In an official blog post, LG has stated that it will be revealing the LG G7 ThinQ successor at MWC 2019, 24th February. LG in partnership with Infineon Technologies AG will use the Infineon REAL3 image sensor chip with Time-of-Flight (ToF) technology in the front-facing camera of the upcoming LG G8 ThinQ.
The camera has been built by Infineon technologies with algorithms for processed 3D point clouds in which the TOF image sensor chip offers more accurate measurements by capturing infrared light which makes it faster and effective in ambient light that reduces the workload on the application process by further reducing the power consumption.
In this, the Time-of-Flight (ToF) technology sees objects in 3D and doesn't get affected by light from external sources. This technology offers excellent recognition rate both inside and out for virtual reality (VR) and augmented reality (AR).
The 3D TOF technology has started making rounds in many OEMs like Honor and Oppo as well. Not much is known about the other specifications of the phone so far and will have to wait till LG officially unveils the phone on 24th February, Mobile World Congress 2019.
“Infineon is poised to revolutionize the market,” said Andreas Urschitz, division president of Infineon’s Power Management & Multimarket division. “We have demonstrated service beyond the mere product level – specifically catering to phone OEMs, associated reference design houses and camera module manufacturers. Within five years, we expect 3D cameras to be found in most smartphones and Infineon will contribute a significant share.”