Union Minister of Information Technology Ashwini Vaishnaw has said that India's semiconductor mission is progressing at a very fast pace and step-by-step milestones are being achieved.
"India's semiconductor mission is progressing at a very fast pace. Step-by-step we are achieving new milestones," the Union Minister said.
Further speaking on India's semiconductor program, the Union Minister said, "Today, Japan and India signed a memorandum of co-operation for semiconductor development, manufacturing, research, design and talent development."
The agreement was signed between Vaishnaw and Japan's Minister of Economy, Trade and Industry Yasutoshi Nishimura in the national capital.
"Japan and India have signed a memorandum for semiconductor design, manufacturing, equipment research, talent development and to bring resilience in the semiconductor supply chain," Vaishnaw said.
The nations will create "implementation organisation" that will work on government-to-government and industry-to-industry cooperation, Vaishnaw added.
ALSO READ | Foxconn withdraws from Rs 1.5 lakh crore semiconductor joint venture, Vedanta says other investors lined up
ALSO READ | Gujarat govt, US firm Micron sign MoU for semiconductor plant in Sanand days after PM Modi's US visit
