Qualcomm, the US-based chipmaker is expected to launch the next Snapdragon 865 processor in two variants that will include a built-in 5G modem and an external 5G modem. According to a report by PhoneRadar, the processors are codenamed SM8250 that will come in two variants and will be launched as the successor to the existing flagship 855 chipsets.
tech editor at Germany-based WinFuture news portal tweeted, "Qualcomm Snapdragon 'Kona55' Fusion sounds like SM8250+ external 5G modem. Not internal. I thought they were going to merge 5G into the main SoC with the next-gen".
The upcoming Snapdragon 865 with integrated 5G would come with the latest Snapdragon X55 5G modem. The report suggests that with the integrated 5G modem, manufacturers will have extra space, which will be used for adding a slightly bigger battery and a better cooling system.
The new Snapdragon 865 would be an ideal chip that comes with an integrated 5G modem that should be a prefered chipset for the markets like South Korea and the US that have higher 5G adoption.
Other markets where 5G would still take time, companies could launch their flagship phones with the latest Snapdragon chipset without the 5G modem.
Qualcomm has verified that the upcoming Snapdragon 5G mobile platform will come with the second-gen sub-6 GHz and mmWave antenna modules that will feature new 5G PowerSave technology that enhances the battery life of the 5G smartphone.
In April, Apple and Qualcomm settled their long-drawn legal war over patents and licensing at an undisclosed amount and Apple agreed to buy chips from Qualcomm for its 5G-equipped iPhone in 2020.
(With IANS inputs)